Winter Quarter 2002 begins in the week of January 7, 2002 and ends the week of March 18, 2002. The first class meeting will be Tuesday, January 8, 2002.
ME 4/510 EPK provides an overview of the mechanical packaging of microelectronic devices. Starting with the bare die, we describe the manufacturing processes necessary to connect, encapsulate, and integrate a chip into a functioning electronic system. Mechanical design considerations at the board and system level that affect the reliability of electronic devices are also presented.
The primary topics covered in the class are:
Senior, graduate student, or post baccalaureate status
Last modified on 11 February 2002 at 10:59:46 AM PST
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