Introduction to Electronic Packaging provides an overview of the mechanical
packaging of microelectronic devices. Starting with the bare die, we describe the
manufacturing processes necessary to connect, encapsulate, and integrate a chip into
a functioning electronic system. Mechanical design considerations at the board and
system level that affect the reliability of electronic devices are also presented.
Gordon Ellison, Adjunct Professor, Mechanical Engineering Department
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Mr. Ellison has in excess of thirty years experience in the analysis
and thermal design of electronic equipment and components, as well as
software design and coding. He has numerous original publications in
the field, including the text Thermal Computations for Electronic Equipment,
1984, Van Nostrand Rienhold. He retired in 1994 from Tektronix, Inc. as Chief
Scientist and Textronix Fellow. He als has a consulting and software company,
Thermal Computations, Inc.
www.ThermalComputations.com.
Description
Thermal Design of Electronic Components and Systems provides the student with
the theoretical background and analysis methods required to predict the thermal behavior
of air-cooled electronic systems and components. The course emphasizes first order
analysis methods of forced and buoyancy driven systems, as well as conductive, natural
and forced convection, and radiative heat transfer in these systems and associated components.
Thermal Management Laboratory provides a survey of laboratory-based
techniques used to diagnose electronic cooling problems, and to obtain design
data for developing thermal management solutions. The course provides
significant practical experience: students design and build their own experiments,
they take and analyze their own data.
The first three weeks of the course is a review of the sensors
and good practices for measuring temperature, pressure, velocity, flow rate, and heat
load in electronic systems. After refreshing these basic skills, students apply
these techniques to physical experiments involving conduction, convection, and
radiation heat transfer. Students learn how to build mock systems useful
in the prototyping phase of equipment development. They learn how to measure
fan and system curves, and how to experimentally determine heat sink performance.
They learn how to measure heat transfer coefficients for components on printed
circuit boards. Measurements are made with hand-held instruments, bench-top instruments,
and with computer controlled data acquisition systems. Data reduction techniques
involving centering (removal of bias error) and uncertainty analysis are used extensively.
Last modified on 22 September 2001 at 12:14:28 PM PDT