ME 445: Thermal Design of Electronic Components and Systems

ME 4/545 provides the student with the theoretical background and analysis methods required to predict the thermal behavior of air-cooled electronic systems and components. The course emphasizes first order analysis methods of forced and buoyancy driven systems, as well as conductive, natural and forced convection, and radiative heat transfer in these systems and associated components.

The primary topics covered in the class are:

Overview of technology trends in microelectronics
Air temperature rise in Forced and Buoyancy Driven Air Flow.
- Electronic Systems
- Ducts and Extrusions (heat sinks)
- Buoyancy Driven Air Draft
Forced Convection Heat Transfer
- Electronic Systems
- Ducts and Extrusions (heat sinks)
- Buoyancy Driven Air Draft
Natural Convection Heat Transfer
Radiation Heat Transfer
Conduction Heat Transfer
- Thermal Interface Resistance
- Analytical models of multidimensional conduction
- Thermal Spreading Resistance
Computer Aided Analysis
- Steady -state thermal network analysis --- TNETFA
- Fourier series analysis --- TAMS, PTAMS

Time and Place for Spring Quarter 2002: Section 1: Tuesdays and Thursdays, 12:00 noon to 1:50 PM, Room 90-7, Fourth Avenue Building; Section 2: Tuesdays and Thursdays, 6:00 noon to 7:50 PM, Room 148, Science Building 2
Instructor: Gordon Ellison, Adjunct Professor, Mechanical Engineering Department <email> <Home Page>

Mr. Ellison has in excess of thirty years experience in the analysis and thermal design of electronic equipment and components, and analysis software design and coding. He has numerous original publications in the field, including the text Thermal Computations for Electronic Equipment, 1984, Van Nostrand Rienhold. He retired in 1994 from Tektronix, Inc. as Chief Scientist and Textronix Fellow. He als has a consulting and software company, Thermal Computations, Inc. www.ThermalComputations.com.
Textbook: Extensive course notes are provided at the beginning of the term. The notes will be made available for purchase (at cost) from a local copy store.

ME 445/545: Thermal Analysis and Design of Electronic Components and Systems

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